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VIA Introduces Single-Chip Embedded Systems Chipset
Posted on 5-Apr-2006 08:11 by H Willan. | Tags Filed under: News.

VIA Technologies, developer of the C7M processor and mini ITX mainboards, has announced the VIA CX700 digital media IGP chipset for the VIA C7R and EdenR processor platforms. The VIA CX700 will be on display at the Embedded Systems Conference show in San Jose, California, happening this week.

This single chip is designed for embedded applications such as Point of Sales (POS) equipment, industrial PCs (IPC) and ultra compact, low power desktop systems such as thin clients and comes in an ultra compact form factor.

Embedded industry systems developers including Advantech, Diamond Systems, Freetech Flexus Computer Technology and WinSystems, are some of whom will be showcasing VIA CX700-based boards at ESC.

In traditional PCs the chipsets are usually separate on the mainboard, with the North/South bridge and Video chipsets requiring their own static heatsinks.

For a single-chip solution the VIA CX700 still has a very complete list of features, including:

  • Memory support for DDR400, DDR2533 and up to 4GB of either 32/64 bit memory
  • 2x COM ports
  • 6x USB2.0
  • 4x PCI slots
  • Optional support for legacy ISA bus devices through an ITC PCI bridge chip
  • VIA integrated audio, VIA Vinyl, HD Audio with support for up to 8 channels
  • VIA Integrated graphics, UniChromeT Pro, 128bit 2D/3D, MPEG2 hardware acceleration for decoding and ChromotionT CE video rendering
  • LVDS/DVI output for video, TV Out and support for dual screens with DuoView.

    The VIA CX700 has a power architecture that enables its compact package to produce a maximum power envelope of just 3.5 watts. Power management technologies are incorporated that monitor activity and dynamically control power according to system load requirements.

    VIA has integrated all the key functionality of both the North and South bridges of a regular VIA chipset into a single chip package exactly the same size as a North bridge, i.e. 37.5mm x 37.5mm, representing a saving of over 34% in board real estate.

    The VIA CX700 SOM-ETX mainboard from Advantech offers customers support for dual screens, CRT/TV and a direct LVDS connection. The new chipset is expected to be available later in Q2, 2006.

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