Intel Centrino Duo Will Include HSDPA Connectivity

Nokia has developed an HSDPA (High Speed Downlink Packet Access) connectivity module for notebook computers, which Intel Corporation will deliver onwards to notebook manufacturers as part of its next-generation Intel Centrino Duo mobile technology platform. The connectivity module will be widely available as an embedded option in a variety of notebooks.

"Notebook users are increasingly interested in wireless broadband access, and 3G offers a strong solution that is available today," said Mooly Eden, vice president and general manager of Intel's Mobile Platforms Group. "This module complements Intel's Wi-Fi and WiMAX solutions to offer expanded connectivity options for notebook users."

In the connectivity module collaboration, Intel takes care of platform design, software, integration and support as well as sales and marketing. Nokia, for its part, brings the 3G HSDPA knowledge as well as carrier relationships. Nokia also manufactures the module.

The companies see combining HSDPA cellular connectivity with other wireless technologies in notebook computers as an enabler for users to easily choose the best radio connection and use their notebooks with a seamless connectivity through wireless networks.