The Board of Directors of the Bluetooth Special Interest Group (SIG), has announced the adoption of Core Specification Version 2.1+EDR (Enhanced Data Rate) by unanimous approval. Through advances in security, simplified pairing and power consumption, the new Bluetooth specification will offer consumers a further improved Bluetooth experience.
The Bluetooth SIG is a trade association representing more than 8,000 members and is responsible for advancing Bluetooth wireless technology.
Before this version of the specification, there were many variations of the user experience when pairing Bluetooth devices. The experience depends on several factors, from the ease of finding menus on different devices to the use of security features. The improved pairing provides a consistent and intuitive pairing solution that includes finding devices, securing the link and authenticating the devices. The benefits of this secure, simple pairing include fewer steps for the user, improved security, and connection in a few seconds.
The new pairing process enables all consumers to quickly start using their Bluetooth devices together. For example, pairing a Bluetooth headset and mobile phone is as easy as turning on the headset, selecting “Add Headset” from the phone menu, and then watching the phone confirm it has found, connected with an encrypted link and paired the headset.
NFC technology may also be used in the new pairing system whereby a user would hold two devices together at a very short range to start the quick pairing process.
Bluetooth Version 2.1 + EDR also offers further optimised power consumption through a feature called Sniff Subrating which increases current battery life by up to five times in many devices like mice, keyboards, watches, home sensor networks and medical devices. With further reduced power consumption, Bluetooth technology strengthens its position as the only viable wireless standard for connecting consumer devices that value low power consumption, low cost and ad hoc connectivity.
The Bluetooth SIG anticipates silicon vendors such as Broadcom, CSR, Infineon and Texas Instruments will have Bluetooth v2.1+ EDR chips available immediately and that the first products will follow by the end of the year.