Posted on 16-Oct-2007 09:59
Filed under: News
Broadcom Corporation have announced a new single-chip HSPA (high-speed packet access) processor that integrates the key 3G (third generation) cellular and mobile technologies on an extremely low power, single 65 nanometer CMOS die.
Broadcom's new "3G Phone on a Chip" solution enables manufacturers to build next generation 3G HSUPA phones with extended features, sleek form factors and very long battery life, all at a fraction of the cost of today's solutions.
Using phones enabled by the new Broadcom HSUPA processor, consumers will be able to download content at up to 7.2 Megabits per second (Mbps), and upload content such as pictures and videos at up to 5.8Mbps, all directly from their phone. HSUPA technology also holds the promise for much higher quality "live" video conferencing and an array of new services and applications.
The BCM21551 3G "Phone on a Chip" combines a high-speed HSUPA 3G baseband, a multi-band radio frequency (RF) transceiver, Bluetooth 2.1 with enhanced data rate (EDR) technology, an FM radio receiver and an FM radio transmitter (for car stereo music playback).
The device also features advanced multimedia processing, up to five Megapixel camera support, and 30 frame per second video with "TV Out," as well as support for the HSUPA, HSDPA, WCDMA and EDGE cellular protocols.
It can even be paired with other Broadcom devices, such as Wi-Fi and GPS, PMU, or the new VideoCore III mobile multimedia processor.
The BCM21551 can be used both in "mass market" high volume 3G "feature phones" as well as smartphones running an open OS such as Symbian, Windows Mobile, or Linux.
Designed and manufactured on a single 65 nanometer silicon die, the BCM21551 integrates dual ARM11 processors to provide open OS support, and features full stereo music capabilities for both headset and stereo speakers as well as an integrated 5-band graphic equalizer and digital mixing capabilities. It also integrates advanced MIPI serial interfaces for the LCD and image sensor and the analog physical layer required for the 480Mbps high speed USB2.0 applications that enable the rapid transfer of multimedia files to and from the handset.
The BCM21551 3G baseband processor is available now to early access customers and is priced at US$23.00 in large quantities.